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Parker Chomerics THERM-A-GAP materials are thermal interface materials engineered specifically for demanding data center applications.
Explore the full lineup of Chomerics THERM-A-GAP pads and gels and learn how to select the right thermal interface materials for advanced data center cooling.
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Complete guide to Chomerics THERM-A-GAP PAD 30 for data center thermal management. Learn specs, applications, and cost-effective solutions for secondary heat sources in servers.

Learn about THERM-A-GAP PAD 60's 6.0 W/m-K thermal conductivity for data center applications. Complete guide covers specifications, compression behavior, design considerations, and converting options for high-performance thermal management.

Discover Chomerics THERM-A-GAP PAD 80, a high-performance thermal interface material with 8.3 W/m-K conductivity for data center applications. Features wide thickness range, low compression force, and reliable electrical isolation.

Discover THERM-A-GAP GEL 30 thermal interface material for data center cooling. Complete guide covering 3.5 W/m-K thermal conductivity, automated dispensing, processor/GPU cooling, and manufacturing integration benefits.

Comprehensive guide to THERM-A-GAP GEL 75 thermal interface material for data center applications. Learn technical specifications, dispensing processes, and design considerations for high-performance thermal management in servers and computing infrastructure.
Learn about THERM-A-GAP GEL 40NS, a non-silicone thermal gel with 4.0 W/m-K conductivity for data center applications. Discover dispensing capabilities, ultra-thin bondlines, and contamination-free optical system compatibility.

Discover THERM-A-GAP GEL 37's 3.7 W/m-K thermal conductivity for data center cooling. Complete guide covering dispensing, specifications, and server applications for thermal management engineers.

Discover Parker Chomerics PAD 70TP thermal gap pad with 7.0 W/m-K conductivity and ultra-soft Shore 00 15 hardness for data center server applications. Complete guide covering thermal properties, processor cooling, memory module thermal management, and design considerations for high-density computing environments.
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