THERM-A-GAP PAD 60: High-Performance Thermal Interface Material for Data Center Applications

Understanding PAD 60 Thermal Performance in Data Centers

PAD 60 is a high-performance thermally conductive gap filler that balances thermal efficiency with mechanical compliance for data center applications. This silicone-based material delivers 6.0 W/m-K thermal conductivity while maintaining low compression forces that protect sensitive electronic components.

Data centers represent one of the most thermally demanding environments in modern electronics. Server racks house increasingly powerful processors that generate substantial heat loads requiring efficient thermal pathways to maintain operational reliability. Understanding the key factors that influence thermal dissipation using thermal interface materials helps engineers address these challenges effectively. PAD 60 addresses these requirements through its combination of high thermal performance and conformability characteristics.

This guide covers PAD 60 material properties, compression behavior, application selection criteria, design considerations, and manufacturing processes for data center engineers specifying thermal interface materials.

Essential Background Reading:

• 5 Keys to Thermal Dissipation: Foundational factors that influence heat transfer in electronic systems
• Understanding Thermal Impedance: Critical design parameters for calculating thermal resistance in your stack-up
• Thermal Interface Materials Selection Guide: How to evaluate TIM options for your specific application requirements
• Complete Engineer's Guide to Thermal Management: Comprehensive overview of thermal management materials and processes

PAD 60 Material Properties and Specifications

Parker Chomerics developed PAD 60 to address the thermal management challenges in high-density computing environments. The material provides effective heat transfer between electronic components and heat sinks while maintaining the conformability necessary for reliable surface contact across uneven topologies.

The silicone-based formulation delivers consistent performance across a wide range of operating conditions. Data center environments may experience temperature fluctuations during startup, load changes, and maintenance cycles. PAD 60 maintains its mechanical and thermal properties throughout these transitions—a consideration that becomes increasingly important when designing components for high-temperature application durability.

Technical Specifications for PAD 60

Engineers evaluating PAD 60 for data center applications should consider these verified specifications:

The 6.0 W/m-K thermal conductivity positions PAD 60 as a high-performance option for applications where thermal resistance directly impacts system reliability. The Shore 00 40 hardness enables the material to conform to surface irregularities without excessive compression forces that could damage components.

PAD 60 Compression and Deflection Behavior

Data center applications often involve components with varying heights across a single circuit board. Gap filler materials must accommodate these topology variations while maintaining consistent thermal contact. PAD 60's deflection characteristics allow engineers to design for predictable thermal performance.

The material exhibits controlled compression behavior that engineers can reliably model during the design phase. Understanding these characteristics helps prevent both under-compression — which creates air gaps and increases thermal resistance — and over-compression — which can damage components or squeeze material away from critical interfaces.

Measured Deflection Data for PAD 60

The deflection data below demonstrates PAD 60's response to applied pressure using a 0.120" (3.05mm) thick sample:

The typical deflection range of 5-40% provides design flexibility while ensuring consistent mechanical behavior. Engineers should target compression levels that achieve adequate surface contact without exceeding component stress limits.

Related Content:

• Thermal Gap Pad Compression Guide: Optimize performance through proper compression and selection methodology
• Thermal Pads vs. Thermal Form-in-Place: Compare gap pads with dispensed thermal interface alternatives
• Advanced Thermal Gel Dispensing: When dispensed thermal materials outperform die-cut pads
• Parker Chomerics Thermal Material Guide: Complete overview of the THERM-A-GAP product family options
• Precision Die-Cut Thermal Interface Materials: When custom converting delivers performance standard solutions cannot

Data Center Applications for PAD 60

PAD 60 serves multiple thermal management applications within data center infrastructure. The material's properties align well with specific component types and cooling architectures commonly found in server designs.

Processor Thermal Management

Processor-to-heatsink interfaces represent a primary application area. CPUs and GPUs generate concentrated heat loads that require efficient thermal pathways to air-cooled heatsinks or liquid cooling cold plates. PAD 60's 6.0 W/m-K thermal conductivity provides effective heat transfer across these critical interfaces while the low compression characteristics protect delicate die structures.

Memory Module Cooling

Memory modules present another common application. DDR memory generates heat during operation that must be managed to prevent throttling and maintain performance. The low compression force characteristics of PAD 60 protect sensitive memory packages while providing thermal coupling to chassis components or dedicated memory heatsinks.

Storage Device Thermal Interfaces

Solid-state drives benefit from PAD 60's thermal properties as well. Enterprise SSDs in data center environments experience sustained write operations that generate significant heat. Thermal interface materials help transfer this heat to enclosure surfaces or dedicated cooling provisions, maintaining drive performance and reliability.

Power Electronics Applications

Power supply units and voltage regulators represent additional applications. These components often require thermal management solutions that accommodate height variations across multiple devices on a single board. PAD 60's conformability and compression characteristics make it suitable for these multi-component interfaces.

Design Considerations for PAD 60 Implementation

Selecting the appropriate PAD 60 thickness requires careful analysis of the mechanical stack-up. Engineers must account for manufacturing tolerances in both the components and the mechanical assembly to determine the optimal gap filler thickness.

Thickness Selection and Tolerances

The standard thickness range of 1.0mm to 5.0mm (0.040" to 0.200") with 0.25mm (0.010") increments provides options for most data center applications. Thickness tolerance is ±10% of the nominal thickness or ±0.25mm (±0.010"), whichever is smaller. These tolerances should be incorporated into the thermal stack-up analysis.

PAD 60 Carrier Options

Two carrier options address different assembly requirements:

• PAD60 (unsupported): The base material without additional backing provides maximum flexibility for applications where the pad will be mechanically captured between surfaces.
• PAD60A (aluminum foil with PSA): This version includes an aluminum foil carrier with pressure-sensitive adhesive for applications requiring permanent attachment to one surface. The adhesive side bonds to heatsinks or chassis components during assembly.

The shelf life differs between these variants. PAD60 maintains its properties for 36 months from shipment when stored at 10°C to 32°C (50°F to 90°F) and 50% relative humidity. PAD60A has an 18-month shelf life due to the adhesive component.

Comparing PAD 60 to Alternative Thermal Interface Materials

Data center thermal management applications present multiple material options. Understanding where PAD 60 fits within the broader solution landscape helps engineers make informed selection decisions.

Thermal Interface Material Comparison

The following comparison highlights where PAD 60 fits among common thermal interface options:

When PAD 60 Is the Right Choice

Thermal gels offer an alternative approach for applications requiring very thin bond lines or automated dispensing. Materials like THERM-A-GAP GEL 75 provide high thermal conductivity with dispensable application, conforming readily to surface irregularities and achieving lower thermal impedance than pads at equivalent thicknesses.

For applications requiring silicone-free formulations, THERM-A-GAP GEL 40NS offers a non-silicone thermal gel alternative that addresses contamination concerns in sensitive environments. However, gels may migrate or pump out under repeated thermal cycling — a consideration for long-lifecycle data center equipment.

Phase change materials provide another option, particularly for applications requiring the thinnest possible thermal interface. These materials transition from solid to liquid at operating temperatures, filling microscopic surface imperfections. Phase change solutions typically require less compression force than gap pads but may need periodic replacement.

PAD 60 occupies the high-performance segment of the gap pad product family. For applications where thermal requirements are less demanding or budget constraints are primary, THERM-A-GAP PAD 30 offers a practical lower-cost alternative with 3.0 W/m-K thermal conductivity. When thermal challenges demand maximum performance, THERM-A-GAP PAD 80 delivers 8.0 W/m-K thermal conductivity for the most demanding data center applications.

Converting PAD 60 for Custom Data Center Components

Converting PAD 60 into custom die-cut parts requires understanding the material's characteristics and their impact on manufacturing processes. Modus Advanced works with Parker Chomerics thermal materials across multiple converting methods.

Die Cutting for Production Volumes

Die cutting provides an efficient method for producing PAD 60 gaskets at production volumes. The material's consistency and handling properties enable reliable conversion with standard die cutting equipment. Engineers should consider minimum feature sizes and wall widths when designing complex geometries.

CNC Cutting for Prototypes

CNC cutting offers flexibility for prototype quantities and complex designs without tooling investment. This method works well for engineering validation before committing to production tooling. Lead times for CNC-cut samples typically measure in days rather than weeks.

Waterjet Cutting for Thick Materials

Waterjet cutting handles thicker sections of PAD 60 effectively. This method provides precise cuts without heat-affected zones that could alter material properties at cut edges.

Converting Tolerances for PAD 60

Tolerances for converted thermal pad parts follow standard elastomeric converting practices. Dense materials like PAD 60 typically achieve ±0.38mm (±0.015") for dimensions under 25.4mm (1.0"). Larger features and thicker materials require appropriately wider tolerances. Engineers requiring tighter tolerances should engage early with their manufacturing partner — tighter specifications remain achievable through specialized fixturing and process optimization, though lead times and costs increase accordingly.

Quality Standards for Data Center Thermal Materials

Data center equipment suppliers often maintain rigorous quality management systems. Manufacturing partners should demonstrate the certifications and processes necessary to support these requirements.

Manufacturing Certifications

AS9100 certification indicates aerospace-grade quality management systems that translate well to high-reliability data center applications. ISO 9001 provides the foundational quality framework. ITAR registration matters for data center equipment serving government or defense customers.

Material Compliance and Traceability

Material traceability becomes important for warranty and failure analysis purposes. Manufacturing partners should maintain lot tracking and documentation that allows components to be traced back to raw material sources.

RoHS compliance is standard for PAD 60, addressing restrictions on hazardous substances in electronic equipment. The material's UL V-0 flammability rating supports fire safety requirements common in data center specifications. For applications requiring specialized surface treatments beyond thermal interface materials, aerospace-grade coatings like high electrical conductance thermal control coatings demonstrate the precision material science capabilities available for mission-critical thermal management systems.

Frequently Asked Questions About PAD 60

What is the thermal conductivity of PAD 60?

PAD 60 delivers 6.0 W/m-K thermal conductivity per ASTM D5470 testing. This high-performance rating makes it suitable for demanding data center applications where efficient heat transfer between processors and cooling solutions is critical.

What compression force does PAD 60 require?

PAD 60 requires minimal compression force due to its Shore 00 40 hardness rating. At 69 kPa (10 psi), the material achieves 13% deflection, providing adequate thermal contact while protecting sensitive electronic components from excessive mechanical stress.

What temperature range does PAD 60 support?

PAD 60 operates reliably from \-55°C to 200°C (-67°F to 392°F). This wide temperature range accommodates both startup conditions and sustained high-power operation in data center environments with various cooling architectures.

What thicknesses is PAD 60 available in?

PAD 60 is available in standard thicknesses from 1.0mm to 5.0mm (0.040" to 0.200") in 0.25mm (0.010") increments. Engineers can select the appropriate thickness based on component gap requirements and mechanical tolerance stack-ups.

Does PAD 60 meet outgassing requirements?

PAD 60 meets stringent outgassing requirements with 0.05% TML and 0.01% CVCM per ASTM E595 testing. These low outgassing characteristics minimize contamination risks in enclosed server environments and controlled data center spaces.

What is the difference between PAD60 and PAD60A?

PAD60 is unsupported material suitable for mechanically captured applications. PAD60A includes an aluminum foil carrier with pressure-sensitive adhesive for applications requiring permanent attachment to one surface. PAD60A has an 18-month shelf life compared to 36 months for PAD60.

Can PAD 60 be custom die-cut?

PAD 60 can be custom die-cut, CNC-cut, or waterjet-cut to precise dimensions for data center applications. Converting tolerances typically achieve ±0.38mm (±0.015") for dimensions under 25.4mm (1.0") when working with experienced thermal material converters.

Next Steps:

• DFM Best Practices for Thermal Management: Design for manufacturability guidance for thermal interface components
• Thermal Management Manufacturing Guide: Scale from prototype thermal pads to production volumes
• Custom Cutting Methods Comparison: Select the right converting process for your thermal pad geometry
• Thermal Contact Resistance Solutions: Engineering approaches to minimize interface thermal resistance
• Thermal Interface Material Data Sheets: Access detailed specifications for PAD 60 and related materials

Partner with Modus Advanced for PAD 60 Converting

Modus Advanced brings decades of experience converting thermal interface materials for demanding applications in aerospace, defense, and commercial electronics. Our engineering team understands the thermal management challenges facing data center designers.

Engineers make up more than 10% of our staff — a deliberate investment that enables us to provide meaningful design feedback rather than simply quoting parts. We engage early in your design process to identify opportunities for improving manufacturability while maintaining thermal performance.

See It In Action:

• Medical Device Thermal Management Case Study: How precision thermal components enabled faster production scaling
• Telecommunications Partnership Case Study: Building a 10-year relationship through quality thermal solutions
• Thermal Management Applications: Explore how we support thermal interface requirements across industries
• Engineering Support Services: Access our engineering team for thermal material selection guidance

Our vertically integrated capabilities allow us to handle multiple manufacturing processes under one roof. This integration reduces lead times, simplifies logistics, and provides single-source accountability for quality. When your data center thermal management components need to arrive on schedule with verified specifications, the Modus approach delivers.

Submit your design to our engineering team today. We strive to turn quotes around within 48 hours, providing the responsiveness your development schedule demands.