Chomerics THERM-A-GAP PAD 30: A Practical Guide for Data Center Thermal Management

The Thermal Challenge in Modern Data Centers

Data centers represent one of the most demanding thermal management environments in modern electronics. Every server rack houses processors, memory modules, storage drives, and power supplies — each generating heat that must be efficiently transferred to cooling systems. The consequences of thermal failure extend beyond component damage to include service interruptions that can cost organizations significant revenue.

The shift toward AI workloads and high-performance computing has intensified these thermal demands. Graphics processing units and specialized AI accelerators generate substantially more heat than traditional CPUs.

Data center designers now face the challenge of balancing thermal performance against the economic realities of deploying solutions across thousands of identical servers. For engineers new to this space, our Essential Guide to Thermal Management provides foundational concepts for navigating these decisions.

Air-cooled servers rely on thermal interface materials like PAD 30 to bridge the gap between heat-generating components and heatsinks or cold plates. This interface represents a critical bottleneck in the thermal path. Poor material selection here undermines the effectiveness of even the most sophisticated cooling infrastructure.

Essential Background Reading:

• Essential Guide to Thermal Management: Foundational concepts for navigating thermal interface material decisions
• Thermal Interface Materials - Making the Right Choice: Framework for evaluating TIM options based on application requirements
• Understanding Thermal Contact Resistance: Engineering solutions for maximizing heat transfer efficiency at interfaces
• Parker Chomerics Thermal Material Guide: Complete overview of the THERM-A-GAP product family and selection criteria

Understanding Where PAD 30 Fits in the Thermal Material Spectrum

Parker Chomerics manufactures thermal interface materials across a wide performance range. PAD 30 occupies a specific position in this spectrum — delivering reliable thermal transfer at a cost point that makes sense for applications where premium materials would be overkill.

The material's 3.2 W/m-K thermal conductivity places it in the moderate performance category. Higher-performance alternatives like PAD 60 and PAD 80 offer thermal conductivities up to 8.0 W/m-K for primary processor applications. These premium materials make sense for primary heat sources like CPUs and GPUs where every degree of temperature reduction matters.

PAD 30 excels in secondary applications. Memory modules, solid-state drives, voltage regulators, and network interface controllers all generate heat that requires management. These components rarely demand the absolute best thermal performance — they need adequate heat transfer at a sustainable cost when multiplied across an entire data center deployment.

Technical Specifications for PAD 30

Engineers evaluating PAD 30 for data center applications should reference these key properties:

PAD 30 Deflection Characteristics

The deflection characteristics deserve particular attention for data center applications. PAD 30 compresses predictably under load:

These values help engineers calculate the appropriate starting thickness based on available clamping force and target compressed thickness. Standard thickness availability ranges from 0.51 mm to 5.08 mm (0.020" to 0.200") in 0.25 mm (0.010") increments.

Related Content:

• THERM-A-GAP PAD 80 Guide: Higher-performance 8.0 W/m-K option for primary processor thermal management
• THERM-A-GAP GEL 37 Guide: Dispensable thermal gel alternative for automated assembly environments
• THERM-A-GAP GEL 30 Guide: Lower-cost dispensable option for moderate thermal performance requirements
• Thermal Pads vs. Thermal Form-in-Place: Decision framework for choosing between pads and dispensed materials
• THERM-A-GAP PAD 70TP Guide: Enhanced tear resistance option for demanding structural requirements

Application Scenarios for PAD 30 in Data Center Environments

Solid-State Drive Thermal Management

Modern enterprise SSDs generate considerable heat during sustained read/write operations. The controller chips and NAND flash packages both require thermal paths to the drive enclosure or heatsink. PAD 30's low compression force makes it well-suited for these applications where excessive pressure could damage sensitive components.

The material's conformability addresses a common challenge with SSD thermal management — the varying heights of components on the drive's PCB. A soft gap filler pad accommodates these height differences while maintaining contact across all heat sources. This eliminates the need for custom-machined heatsinks with pockets for each component.

Memory Module Cooling

High-bandwidth memory configurations in AI servers generate substantial heat. DIMMs packed into dense configurations create thermal management challenges that traditional airflow alone cannot solve. Thermal pads between memory modules and heatspreaders provide a direct conductive path for heat removal.

PAD 30's cost profile makes it practical for these applications where a single server might contain dozens of memory modules. The mathematics of data center deployment favor materials that deliver adequate performance at volumes measured in thousands of pieces.

Power Conversion Components

Voltage regulators and power delivery components operate throughout the server enclosure. These devices require thermal management but rarely justify premium interface materials. PAD 30 provides reliable heat transfer for DC-DC converters, MOSFETs, and inductors in power delivery systems.

The material's electrical isolation properties prove valuable here. A dielectric strength of 5.9 kV/mm (150 V/mil) prevents unintended electrical paths between power components and heatsinks or chassis.

Design Considerations for Manufacturing PAD 30 at Scale

Data center deployments demand manufacturing consistency across large volumes. A thermal pad that performs well in prototype quantities must maintain that performance when produced in hundreds of thousands of pieces. Engineers evaluating their options should understand whether thermal pads or thermal form-in-place dispensing best fits their assembly process.

Several factors influence manufacturability:

• Carrier selection: The woven glass carrier (PAD30G) provides dimensional stability during die cutting operations, making it the preferred choice for high-volume converting.
• Thickness tolerance: Standard tolerance is ±10% of nominal thickness or ±0.25 mm (±0.010"), whichever is smaller. Design engineers should account for this variation in their thermal stack-up calculations.
• Part geometry: Simple rectangular shapes convert efficiently. Complex geometries with narrow features or tight inside corners may require waterjet cutting rather than die cutting to maintain dimensional accuracy.
• Adhesive options: The aluminum foil carrier with PSA (PAD30A) simplifies assembly but adds cost. Evaluate whether the assembly time savings justify the material premium for your specific application.

Comparing PAD 30 to Alternative Thermal Solutions

The decision to specify PAD 30 should consider the full range of available options:

Thermal gels offer advantages in automated assembly environments where dispensing equipment is already installed. Materials like THERM-A-GAP GEL 37 provide excellent thermal performance for high-volume dispensing applications. For applications requiring slightly lower thermal conductivity at reduced cost, THERM-A-GAP GEL 30 delivers reliable performance in data center thermal management. Facilities without dispensing infrastructure may find die-cut pads more practical.

Phase change materials provide excellent thin bondline performance — critical for direct CPU contact applications. PAD 30 serves different applications where thicker gaps must be bridged and thin bondline performance is less critical. Engineers working with balanced thermal and structural requirements may also want to explore PAD 70TP for applications requiring enhanced tear resistance.

Quality and Converting Considerations for PAD 30

Converting thermal gap pads requires precision to maintain consistent thermal performance. Variations in cut quality, handling damage, or contamination can create air pockets that increase thermal resistance.

Modus Advanced maintains converting capabilities that address these challenges. Die cutting, waterjet cutting, and CNC cutting each offer advantages for different part geometries and volumes:

• Die cutting: Optimal for simple geometries at production volumes where tooling investment is justified
• Waterjet cutting: Ideal for thick materials, precise corners, or prototype quantities without tooling lead time
• CNC cutting: Provides flexibility for complex geometries and rapid design iteration

Our AS9100 and ISO 9001 quality systems ensure consistent material handling and dimensional accuracy. These certifications reflect processes developed for aerospace and defense applications — industries where thermal management failures carry serious consequences. 

Working with Your Manufacturing Partner

Early engagement with your converting partner can prevent costly design iterations. Material behavior during cutting, handling characteristics, and assembly considerations all influence the optimal design approach. Understanding what to expect from your Parker Chomerics distributor helps establish productive working relationships from the start.

Engineers should consider these questions when specifying PAD 30 for data center applications:

• Gap tolerance stack-up: What is the expected variation in gap dimension? Does the selected pad thickness accommodate this variation while maintaining adequate compression?
• Assembly method: Will pads be applied manually or through automated pick-and-place? The answer influences carrier and adhesive selection.
• Rework requirements: Can pads be removed and replaced in the field? This affects adhesive specification.
• Thermal validation: What testing will validate thermal performance? Your converting partner can provide samples matched to production material for prototype validation.

Next Steps:

• Thermal Gap Pad Compression Guide: Optimize performance through proper compression selection and application
• Precision Die Cut Thermal Interface Materials: When standard converting solutions don't meet your precision requirements
• Thermal Management DFM Best Practices: Design for manufacturing guidance for thermal interface applications
• Custom Gasket Cutting Methods Comparison: Die cutting vs waterjet vs digital cutting method selection guide
• Working with Your Parker Chomerics Distributor: What to expect when partnering with a Chomerics converting specialist

Frequently Asked Questions About PAD 30

What is the thermal conductivity of PAD 30?

PAD 30 delivers a thermal conductivity of 3.2 W/m-K, positioning it as a moderate-performance thermal interface material. This makes it ideal for secondary heat sources in data center applications where premium materials would be cost-prohibitive across high-volume deployments.

What thickness options are available for PAD 30?

PAD 30 is available in standard thicknesses ranging from 0.51 mm to 5.08 mm (0.020" to 0.200") in 0.25 mm (0.010") increments. Standard tolerance is ±10% of nominal thickness or ±0.25 mm (±0.010"), whichever is smaller. Custom thicknesses may be available upon request.

What carrier options does PAD 30 offer?

Engineers can select from multiple carrier configurations: unsupported (no carrier), woven glass (PAD30G), aluminum foil with PSA (PAD30A), PEN film (PAD30PN), or thermally enhanced polyimide. The woven glass carrier provides dimensional stability preferred for high-volume die cutting operations.

What is the operating temperature range for PAD 30?

PAD 30 performs reliably across a wide operating temperature range from -55°C to 200°C (-67°F to 392°F). This range covers virtually any data center operating condition, including both normal operations and thermal stress scenarios.

How does PAD 30 compare to PAD 60 and PAD 80?

PAD 30 offers 3.2 W/m-K thermal conductivity at a lower cost point, making it ideal for secondary heat sources. PAD 60 provides 6.0 W/m-K for moderate heat sources, while PAD 80 delivers 8.0 W/m-K for primary processors. Material selection depends on thermal requirements and budget constraints.

What compression deflection should I target for PAD 30?

PAD 30's typical deflection range is 10-35%. At 34 kPa (5 psi), expect approximately 17% deflection. At 69 kPa (10 psi), expect approximately 26% deflection. Target compression should balance thermal performance against component stress limitations.

See It In Action:

• What to Expect from Your Thermal Management Partner: Key criteria for evaluating thermal interface material converting partners
• Thermal Management Manufacturing - Prototype to Production: How thermal interface materials scale from development to high-volume production
• Thermal Management Resource Center: Complete collection of thermal interface material guides and specifications
• Building a Robust Quality System: How AS9100 and ISO 9001 quality systems ensure thermal pad consistency

Partner with Modus Advanced for Your Data Center Thermal Needs

Data center thermal management demands materials and converting partners that understand the balance between performance and economics. Modus Advanced brings decades of experience converting thermal interface materials for demanding applications across aerospace, defense, medical, and telecommunications industries.

Our engineering team provides design for manufacturability feedback that helps optimize your thermal pad designs for production efficiency. We work with Parker Chomerics materials and maintain strategic relationships that support competitive pricing and reliable supply chains. More than 10% of our staff are engineers — ensuring you have direct access to technical expertise throughout your project.

Submit your design to our engineering team for rapid prototyping support and DFM review. We strive to turn quotes around within 48 hours — because in data center construction, one day matters.