Why We Work With Nolato Compatherm®
Our partner, Nolato Silikonteknik, has expanded its innovative product line to include thermal interface materials (TIMs). Compatherm® thermally conductive gap filler is ideal for applications requiring heat transfer from a PCB to a heat sink. These ultra soft and conformable materials can drastically cut thermal resistance and greatly enhance cooling by filling air gaps and very small irregularities.
Nolato certifies the thermal conductivity (W/mk) of every pad we deliver. With production capabilities in the USA and China, Modus Advanced, Inc. is positioned to deliver thermal pads anywhere in the world.
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