Our partner, Nolato Silikonteknik, has expanded its innovative product line to include thermal interface materials (TIMs). Compatherm® thermally conductive gap filler is ideal for applications requiring heat transfer from a PCB to a heat sink. These ultra soft and conformable materials can drastically cut thermal resistance and greatly enhance cooling by filling air gaps and very small irregularities.
Nolato certifies the thermal conductivity (W/mk) of every pad we deliver. With production capabilities in the USA and China, Modus Advanced, Inc. is positioned to deliver thermal pads anywhere in the world.
Certified Thermal Conductivity
Ultra Soft with Low Compression Force
Fits Well on Protrusions and Recessed Areas
Self-Tacky and Adheres Well to Most Surfaces
Nolato Compatherm Overview
“I appreciate everything Modus® did for Hubbell, when we had an emergency a couple of months ago - it is not forgotten. I have stressed to our engineers that Modus® should be included in any quote activity on new parts. Hence, you will continue to see more orders coming in from Hubbell this year and beyond. Thank you and I look forward to continued success of our great partnership.”
THOMAS HOLSCHER | HUBBELL